cas1
Committee
Paper Submission
 
 
 
Dr. Nam-Sung Woo, President & General Manager, Samsung Electronics Co., Ltd.

Time: 09:20-10:20am
Date: Monday, May 21, 2012
Room: Auditorium (3F)

Smart mobile devices are growing very fast in volume and becoming more intelligent and powerful. As a result, smart mobile devices require higher performance and lower power consumption for their components. In addition, they must avoid a "thermal" problem as well.
In this talk, we will present how semiconductor industry, including design, process and manufacturing communities, has evolved to cope with the tough requirements. We will also introduce recent trends and new challenges of the industry. We will use two groups of semiconductor products, AP (application processor) SOC and CMOS camera sensors, as tools of our observation because they are key elements of smart mobile devices while having very different characteristics.
We will also describe how Samsung's System Semiconductor team is preparing for future challenges.

Biography

 

Dr. Nam-Sung Woo is a President and General Manager of the System LSI Business of Samsung Electronics’ Device Solutions. Samsung’s System LSI Business consists of 3 major business areas - SOC, LSI, and ASIC/Foundry - and boasts a diverse product portfolio that includes display driver ICs, smart card ICs, application processors, and CMOS image sensors.
Dr. Woo first joined Samsung Electronics in 2004 as Executive Vice President and head of Mobile Solution Development at its System LSI Business, and in 2007 was appointed as head of SOC Research and Development. Dr. Woo became General Manager of the System LSI Business in May 2008 and was promoted to President in December 2010.
Since joining Samsung Electronics, Dr. Woo gained recognition for overseeing product development of application processors for Smartphone and Tablet PC in achieving number one market share globally, and for guiding the successful acquisition of an Israeli image sensor company in 2007.

 

Prior to joining Samsung Electronics, Dr. Woo served from 1999 to 2003 in several senior management positions at Texas Instruments(TI) related to wireless technologies, rising to the position of Business Director and General Manager of Texas Instrument’s UMTS Terminal Chipset Business in 2001. He was also a Distinguished Member of Technical Staff (DMTS) at TI. From 1996 to 1999 Dr. Woo served as President of Sansearch, a CDMA chipset solution company in San Diego, California. From 1983-1996 he served as a research scientist at the Communication Research Division of Bell Laboratories, Murray Hill, New Jersey. His research areas included computer architecture, parallel processing, and VLSI design.

Dr. Woo has published numerous papers and articles, and received Best Paper Award at the 31st IEEE Design Automation Conference in 1994. He received B.S. in Electrical Engineering from Seoul National University, M.S. in Electrical Engineering from KAIST (Korea Advanced Institute of Science and Technology), and Ph.D in Computer Science from the University of Maryland, College Park, USA.

 
 
 

Prof. Chenming Hu, University of California at Berkeley

Time: 08:30-09:30am
Date: Tuesday, May 22, 2012
Room: Auditorium (3F)

Circuit size and power reductions drive the proliferation of electronics. FinFET is used by Intel at 22nm and foundries will move to it at 14nm. FinFET is a 3D and multiple-gate MOSFET, but the basic reason for its ability to scale to single digit nm is the thinness of its body as will be illustrated with an alternative structure. FinFET also open doors to reduced circuit voltage and power. Even more exciting order of magnitude power reduction may be possible with future transistors based on different electron transport physics.

Biography

 

Dr. Chenming Hu has been called the Father of 3D Transistors for leading FinFET development in 1999. Intel is the first company to use FinFET in 2011 production calling it the most radical shift in semiconductor technology in over 50 years. Other companies are expected to follow. Asian American Engineer of the Year Award cited his first industry standard transistor model "used in designing IC products with cumulative sales of many hundred billion dollars".   IEEE called him "Microelectronics Visionary" and noted his pioneering contributions to integrated circuit reliability in presenting him the Nishizawa Medal for "achievements critical to producing smaller yet more reliable and higher-performance integrated circuits". US Semiconductor Industry Association thanked him for research leadership for "advancement of the electronics industry and of our national economy". IEEE EDS gave him the 2011 Education Award for "distinguished contributions to education and inspiration of students, practicing engineers and future educators".

 

Dr. Hu is a board director of SanDisk Corp. and of the nonprofit Friends of Children with Special Needs. From 2001 to 2004 he was the Chief Technology Officer of TSMC, world's largest dedicated integrated circuits manufacturing company.   He was the board chairman of the nonprofit East Bay Chinese School, Oakland, CA. and the founding chairman of Celestry Design Technologies until acquisition by Cadence Design Systems in 2002.

He has authored four books including a new textbook and 900 research papers, and has been granted over 100 US patents. He is honored with memberships in three national academies -- the  US National Academy of Engineering, the Chinese Academy of Sciences, and  Academia Sinica. He is a fellow of the IEEE and an Honorary Professor of CAS Microelectronics Institute and National Chiao Tung University.   His many awards include the 2007 Andrew Grove Award for device reliability research and the 2002 Donald Pederson Award in Solid State Circuits for the BSIM standard transistor model. The 2009 SRC Aristotle Award recognized him as an influential mentor to many outstanding students.  He has received UC Berkeley's highest honor for teaching -- the Berkeley Distinguished Teaching Award. He is researching green tunnel transistor for ultra-low-power electronics.

Dr. Hu received his B.S. degree from National Taiwan University, which honored him with the Distinguished Alumni Award in 2011, and the M.S. and Ph.D. degrees from UC Berkeley all in electrical engineering. He shares an interest in painting with his sons Raymond and Jason.

 
 
 
Prof. Roland Thewes, TU Berlin

Time: 08:30-09:30am
Date: Wednesday, May 23, 2012
Room: Auditorium (3F)

A couple of decades ago, first announcements appeared how the dense spatial concentration of smart functionalities on CMOS chips could be used to enable new applications in the biomedical domain. Meanwhile that field ranges from in-vitro applications such as bio-molecule sensors to in-vivo prosthetic devices.
While this topic and related applications have become very popular in recent years, also a number of questions arise: Transferring the signal processing capabilities of smart solid-state CMOS chips into the wet world of biology, what is science and what is science fiction today? Are these worlds – long-term – compatible to each other? What is the volume behind such applications? Who drives enhancements in this area – the semiconductor industry, system houses, physicians, scientists… , the ageing society?
In this presentation, a topical overview will be given about the technical achievements received so far starting from in-vitro bio-molecule detection related issues to in-vivo neural tissue interfacing related applications. Main challenges inside and outside the circuit and system design community will be highlighted. Moreover, the potential and limitations of smart biomedical systems including side aspects such as assembly and packaging will be discussed.

Biography

 

Dr. Roland Thewes received the Dipl.-Ing. degree and the PhD degree in Electrical Engineering from the University of Dortmund, Dortmund, Germany, in 1990 and 1995, respectively. In 1994, he joined the Research Laboratories of Siemens AG, where he was active in the design of non-volatile memories and in the field of reliability and yield of analog CMOS circuits. From 1997-1999, he managed projects in the fields of design for manufacturability, reliability, analog device performance, and analog CMOS circuit design. From 2000-2005, he was responsible for the Lab on Mixed-Signal Circuits of Corporate Research of Infineon Technologies focusing on CMOS-based bio-sensors, low voltage analog CMOS circuit design, and device-circuit interaction. From 2006 until March 2009, he was heading a department focusing on Advanced DRAM Core Circuitry in the Product Development Division of Qimonda. Moreover, since 2005 he also has been serving as a consultant of the Max-Planck Society in the area of CMOS-based neural interfacing.

 

Since April 2009, he is a full professor at TU Berlin focusing on electronic sensors and actuators for bio-sensing and neural interfacing purposes. He has authored or co-authored more than 120 technical publications including book chapters, tutorials, invited papers, etc., and authored or co-authored a similar number of granted patents and patent applications. He is a member of the Technical Program Committees of ISSCC and ESSCIRC, and of the Joint Steering Committee of ESSDERC/ESSCIRC. In the past he also served as a member of the Executive Committee of IEDM, and as a member of the Technical Program Committees of IEDM, IRPS, ESSDERC, and ESREF. He is a recipient of the German President’s Future Award (2004), the ISSCC 2002 Jack Raper Award (2003), and recipient or co-recipient of 6 further paper and conference awards. Dr. Thewes is a Senior Member and Distinguished Lecturer of the IEEE.